电子元器件银离子迁移评价方法的探究

家电科技 ›› 2018, Vol. 0 ›› Issue (7): 84-87.

电子元器件银离子迁移评价方法的探究

鲍建科

松下家电研究开发（杭州）有限公司浙江杭州 310018

出版日期:2018-07-01 发布日期:2019-07-08

A study on evaluation method of electronic components for the silver ion migration

BAO Jianke

Panasonic Home Appliances R&D Center (Hangzhou) Co., Ltd. (PHARADH) Hangzhou 310018

Online:2018-07-01 Published:2019-07-08

摘要/Abstract

摘要： 随着电子设备变得更小、更轻、更先进,使用环境更加恶劣,发生银离子迁移的几率也比以往更大。本文在详细介绍银离子迁移现象、机理的同时,全面分析了影响银离子迁移的各类因素,得出评价银离子迁移切实可行的加速试验方法和时间公式,有效地缩短了评价时间。根据经验总结了故障解析的流程以及银离子迁移的发生条件,提出了在银离子迁移过程的每一个步骤中采取措施的策略,防止迁移的再发生。

关键词: 银离子迁移, 加速试验, 故障解析, 再发防止

Abstract: As electronic devices become smaller, lighter, and more advanced, meanwhile its working environment even worse, the chance of silver ion migration is greater than ever before. This paper introduces the phenomenon and mechanism of silver ion migration, as well as various factors that affect the silver ion migration in detail, the time formula for a realistic accelerated test to evaluate silver ion migration is obtained, which effectively shortened the evaluation time. Based on the experience of the process of fault analysis and the conditions of silver ion migration, a strategy for taking measures in each step of silver ion migration is proposed, which prevents the occurrence of migration.

Key words: Silver ion migration, Accelerated test, Fault analysis, Prevent recurrence

鲍建科. 电子元器件银离子迁移评价方法的探究[J]. 家电科技, 2018, 0(7): 84-87.

BAO Jianke. A study on evaluation method of electronic components for the silver ion migration[J]. Journal of Appliance Science & Technology, 2018, 0(7): 84-87.