功率器件键合点外观一致性提升的方法

家电科技 ›› 2018, Vol. 0 ›› Issue (1): 52-54.

功率器件键合点外观一致性提升的方法

徐世明

珠海格力新元电子有限公司广东珠海 519110

出版日期:2018-01-01 发布日期:2019-07-12
作者简介:徐世明,810895630@qq.com

A methold to improve the appearance consistency of the power devices wire bonding

XU Shiming

Zhuhai GREE Xinyuan Electronics Co. Ltd. Zhuhai 519110

Online:2018-01-01 Published:2019-07-12

摘要/Abstract

摘要： 本文提出了一种半导体行业键合工艺新的方法,力图消除键合过程中引线框架与金属基座间的共振问题,提升功率器件键合点的外观一致性。

关键词: 功率器件, 键合, 防震基座

Abstract: This paper presents a new methold for wire bonding process of semiconductor industry, to eliminate the resonant problem between lead frame and metal base in wire bonding process, and to improve the appearance consistency of the power devices wire bonding.

Key words: Power devices, Wire bonding, Shockproof base

徐世明. 功率器件键合点外观一致性提升的方法[J]. 家电科技, 2018, 0(1): 52-54.

XU Shiming. A methold to improve the appearance consistency of the power devices wire bonding[J]. Journal of Appliance Science & Technology, 2018, 0(1): 52-54.