家电科技 ›› 2021, Vol. 0 ›› Issue (4): 86-90.doi: 10.19784/j.cnki.issn1672-0172.2021.04.017

• 论文 • 上一篇    下一篇

钨/类金刚石复合膜的摩擦磨损行为研究

汪云海1,2, 李星1, 强克迪2, 毛晶晶1   

  1. 1.航天科工武汉磁电有限责任公司特种材料检测试验中心 湖北武汉 430000;
    2.珠海格力电器股份有限公司工艺研究中心 广东珠海 519000
  • 出版日期:2021-08-01 发布日期:2021-08-09
  • 作者简介:汪云海(1989-),男,硕士/工程师。研究方向:金属材料表面改性。地址:湖北省武汉市东湖高新开发区华光大道5-2号。E-mail:499683663@qq.com。

The tribological behavior of W/Diamond-like carbon composite films

WANG Yunhai1,2, LI Xing1, QIANG Kedi2, MAO Jingjing1   

  1. 1. China Aerospace Science & Industry Wuhan Magnetoelectric Co., Ltd. The Testing Center Of Special Material Wuhan 430000;
    2. Gree Electric Appliances, Inc. Of Zhuhai, Craft Research Center Zhuhai 519000
  • Online:2021-08-01 Published:2021-08-09

摘要: 采用复合磁控溅射法在高速钢HAP40表面制备了钨(W)/类金刚石(Diamond-like carbon,DLC)复合膜,通过调整工艺参数获得了5 μm厚的复合膜(W层:1.7 μm;WXCY层:0.3 μm;DLC层:3 μm),重点研究了W/DLC复合膜的结构组分、截面形貌和摩擦磨损行为。结果表明:W和WXCY复合层的存在有利于降低DLC层的生长内应力,改善其界面结合情况;W/DLC复合膜的主要磨损形式为滑动磨损,表面基本没有粘附铝元素,但是会吸附空气中或润滑油中的氧;W/DLC复合膜中存在大量氢原子饱和σ悬键,使复合膜表面被钝化,进而获得低摩擦系数。

关键词: 磁控溅射, 类金刚石膜, 复合膜, 摩擦磨损, 表面钝化

Abstract: The composite films of W/Diamond like carbon (DLC) were prepared on the surface of high speed steel HAP40 by magnetron sputtering. A 5 μm thick composite films (W layer: 1.7 μm; WXCY layer: 0.3 μm; DLC layer: 3 μm) was obtained by adjusting the process parameters. The structure, cross-sectional morphology and friction and wear properties of W/DLC composite films are mainly studied. The results show that the existence of W and WXCY composite layer is benefit to reduce the growth stress of DLC layer and improve its interface bonding. The main wear form of W/DLC composite films is sliding wear which does not adhere aluminum powder, but it would absorb oxygen atom from the air or lubricating oil. There are a lot of hydrogen saturated σ-dangling bonds in W/DLC composite films, which passivates the surface of the composite film and leads to low friction coefficient.

Key words: Magnetron sputtering, Diamond-like carbon film, Composite films, Friction and wear, Surface passivation

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