家电控制器回流焊接过程空洞产生原理研究与防治
徐敬伟, 冯烈, 邓丽芳, 李毅鹏
Research and Prevention of void generation during Reflow Soldering of home appliance controller
XU Jingwei, FENG Lie, DENG Lifang, LI Yipeng
家电科技
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2020, (zk): 246
-250
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DOI: 10.19784/j.cnki.issn1672-0172.2020.99.061
