Abstract: Because the single panel only has copper foil pad on one side of PCB, it is difficult for tin wave to form good wetting and tin on the pins of plug-in devices during wave soldering, so there are often through-hole defects after welding. Comprehensively analyzes the through-hole defects of single panel, compares and follows up the improvement of PCB plate resin structure, punching process, different punching times, different plates and different processing manufacturers, and checks and confirms the parameter settings of wave soldering wire body. The results show that PCB substrate is the main cause of through-hole confirmation. By adjusting the resin structure of PCB plate, the zigzag strength of PCB plate can be changed, so as to improve the phenomenon of copper skin warping and burr in the hole during PCB hole processing, and then reduce the generation of through-hole defects.

Key words: PCB, Sheet, Test research, Through hole