Abstract: When air conditioning products are committed to achieving miniaturization of outdoor units, the installation and layout space of the electronic control system is drastically reduced, and the distribution density of internal electronic components significantly increases. Such spatial constraints lead to massive heat accumulation, causing the difficulty of heat dissipation to rise exponentially, which in turn triggers the temperature rise problem of the electronic control system.To effectively address this challenge, research was conducted focusing on heat dissipation components. By applying Bernoulli's principle, parameters such as air duct diameter and flow velocity were meticulously designed to achieve precise regulation of fluid pressure and flow rate. establishing a three-dimensional model with 120,000 grids through CFD simulation, combined with a built constant temperature environment testing system, to conduct multi-dimensional verification of the new dual-duct heat dissipation structure. Experimental data show that the optimized scheme reduces the temperature rise of the IPM module by 5.1% and improves the heat dissipation efficiency by 18.6%, showing significant advantages compared with traditional schemes and similar technologies reported in the literature. The research results provide quantifiable technical references for the miniaturization design of air conditioner outdoor units.

Key words: Air conditioner, Heat dissipation, Temperature rise