关键词: 变频空调, 散热器, Ansys Icepak, 优化设计

Abstract: Heat dissipation has become a bottleneck problem in the design of air conditioning motherboards and unreasonable heat dissipation causes the motherboard to burn out. At present, the design of the radiator is mainly based on experience and actual measurement, the key influence parameters of the radiator are insufficiently understood, and the design is blind. Takes an inverter air conditioner as the research object, and uses Ansys-Icepak to establish the heat dissipation simulation method. Through the actual measurement, the influence of the heat sink substrate thickness, fin height, fin spacing and other key parameters on the heat dissipation effect is deeply studied. The results show that the simulation analysis method is consistent with the measured trend, which can guide the design and improve the design efficiency. Fin spacing and substrate thickness should not be too large or too small, due to cost and space constraints, the fin length cannot be too long. When the fin pitch is 4~6mm, the substrate thickness is 5~7mm, and the fin length is 50~70mm, it is an optimal heat sink.

Key words: Inverter air conditioner, Heat sink, Ansys Icepak, Optimized design