家电科技 ›› 2026, Vol. 0 ›› Issue (4): 120-125.doi: 10.19784/j.cnki.issn1672-0172.2026.04.020

• 论文 • 上一篇    下一篇

真空绝热板隔热性能的衰减特性研究

马钲沅1, 李平2, 王启安2   

  1. 1.小米智能家电(武汉)有限公司 湖北武汉 430000;
    2.小米(武汉)科技有限公司 湖北武汉 430000
  • 出版日期:2026-08-01 发布日期:2026-09-30
  • 作者简介:马钲沅,博士学位。研究方向:传热传质、家电。地址:湖北省武汉市江夏区小米武汉科技园。E-mail:mazhengyuan@outlook.com。

Study on the attenuation mechanism of thermal insulation performance of vacuum insulation panels

Ma Zhengyuan1, Li Ping2, Wang Qi’an2   

  1. 1. Xiaomi Smart Appliances (Wuhan) Co., Ltd. Wuhan 430000;
    2. Xiaomi (Wuhan) Technology Co., Ltd. Wuhan 430000
  • Online:2026-08-01 Published:2026-09-30

摘要: 为揭示安装结构与封装热桥对制冷装置内真空绝热板(VIP)隔热性能的影响机制,建立二维稳态传热模型,研究VIP与背部壳体安装间距及铝膜热桥的独立与耦合效应:先设定理想化无热桥工况,量化安装间距带来的隔热性能衰减规律;再引入高导热铝膜模拟实际封装热桥结构。结果表明:在理想条件下,热负荷随间距(0 mm~100 mm)上升,相对增长率为63.8%,存在30 mm关键阈值;铝膜热桥是性能劣化主因,零间距时热负荷达理想状态近3倍(δ≈2.93),且铝膜形成“热短路”导致热流汇聚旁路。得出结论:优化VIP隔热系统的首要任务是阻断或削弱连续性铝膜热桥,其次需将安装间距严格控制在最小必要范围。为高性能真空隔热系统的结构设计与工程应用提供了明确的理论依据与优化路径。

关键词: 真空绝热板, 制冷设备, 传热特性, 热桥效应

Abstract: To reveal the influence mechanism of the installation structure and encapsulated thermal bridges on the thermal insulation performance of Vacuum Insulation Panels (VIPs) in refrigeration equipment, a two-dimensional steady-state heat transfer model was established to study the independent and coupling effects of the installation spacing between VIPs and the back shell as well as the aluminum mold encapsulated thermal bridges. First, an idealized scenario without thermal bridges was established to quantify the decline in thermal insulation performance resulting from installation spacing; then, a highly thermally conductive aluminum foil was introduced to simulate the thermal bridge structure found in actual packaging. The results show that under ideal conditions, the heat load increases monotonically with the spacing (0 mm~100 mm), with a relative growth rate of 63.8%, and there exists a critical design threshold of approximately 30 mm. The aluminum mold thermal bridge is the dominant factor leading to performance degradation; its introduction increases the system heat load to nearly 3 times that of the ideal state at zero spacing (thermal bridge degradation coefficient δ≈2.93), and a further increase in spacing (to 100 mm) results in an additional 27% increase in heat load on this basis. Visualization analysis of the temperature field and heat flow lines indicates that the aluminum mold forms an efficient "heat short-circuit" path, leading to severe heat flow convergence and bypass. It is concluded that the primary task in optimizing the VIP thermal insulation system is to block or weaken the continuous aluminum mold thermal bridge, followed by strictly controlling the installation spacing within the minimum necessary range, provides a clear theoretical basis and optimization path for the structural design and engineering application of high-performance vacuum thermal insulation systems.

Key words: Vacuum insulation panel, Refrigeration equipment, Heat transfer, Thermal bridge effect

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