家电科技 ›› 2020, Vol. 0 ›› Issue (zk): 246-250.doi: 10.19784/j.cnki.issn1672-0172.2020.99.061

• 材料与零部件 • 上一篇    下一篇

家电控制器回流焊接过程空洞产生原理研究与防治

徐敬伟, 冯烈, 邓丽芳, 李毅鹏   

  1. 珠海格力电器股份有限公司 广东珠海 519000
  • 出版日期:2020-11-10 发布日期:2021-01-05
  • 通讯作者: 冯烈 f867512281@163.com

Research and Prevention of void generation during Reflow Soldering of home appliance controller

XU Jingwei, FENG Lie, DENG Lifang, LI Yipeng   

  1. Gree Electric Appliances,Inc.of Zhuhai Zhuhai 519000
  • Online:2020-11-10 Published:2021-01-05

摘要: 针对家电行业控制器回流焊空洞问题,运用ANSYS软件,模拟不同气压下,气泡逃逸的过程及差异性。研究发现,熔融状态锡液中气泡的逃逸分为两个阶段,第一阶段气泡受惯性力作用,随着锡液往下运动,直至整个系统平衡,第二阶段,气泡受锡液表面张力作用,往外逃逸,直至溢出气泡;随着气压增大,气泡所需逃逸时间越长,两者呈非线性关系,因此调整气压可以有效减少空洞的产生。通过设计实验,采用6种气压环境进行了真空焊接实验,运用X-ray对焊点进行了检测,焊接气压越小,空洞尺寸越小,对空洞的产生有抑制作用。

关键词: 家电控制器, 回流焊, 焊接空洞, ANSYS仿真

Abstract: Aiming at the problem of reflow soldering voids in the home appliance industry, using ANSYS software to simulate the process and difference of bubble escape under different air pressures. The study found that the escape of bubbles in the molten tin liquid is divided into two stages. In the first stage, the bubbles are subjected to inertial forces, and the tin liquid moves downward until the entire system is balanced. In the second stage, the bubbles are affected by the surface tension of the tin liquid , Escape outwards until the bubbles overflow; as the air pressure increases, the longer the time required for the bubbles to escape, the two have a nonlinear relationship, so adjusting the air pressure can effectively reduce the occurrence of voids. Through the design experiment, the vacuum welding experiment was carried out using 6 kinds of air pressure environments, and the welding points were detected by X-ray. The smaller the welding air pressure, the smaller the cavity size, which has the effect of suppressing the occurrence of cavity.

Key words: Home appliance controller, Reflow soldering, Welding cavity, ANSYS simulation

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