Abstract: With the development of heating technology, traditional cooking appliances can't obtain high-quality cooking needs; Solid-state sources are used as energy generating devices in new-type RF cooking appliances. Especially the power chip will generate a lot of heat loss in the RF circuit during the operation of solid-state sources, if these heat losses can't be dissipated in time, it will affect the efficiency and reliability of the chip, and reduce the performance indicators of the solid-state source. This paper proposes a high-efficiency double-layer drainage heat dissipation solution, which adopts an unbalanced ratio upper and lower high-efficiency synchronous heat dissipation technology, local copper embedding, and a high-volume, low-noise streamlined air duct design, which reduces the temperature of the power chip substrate by 41°C, it aims to achieve a more efficient heat dissipation design.

Key words: RF cooking appliances, RF heating systems, Solid-state sources, Partial copper embedding, Double-layer drainage and heat dissipation