Abstract: Compared with traditional microwave heating technology, RF oven using solid-state microwave heating technology which is heating fast and uniform, the status of food heating can be intelligent feedback, the size of core component power amplifier on electronics control board is small but with large power consumption, cause extremely high heat density. The traditional extruded heat sink cannot be effective under harsh ambient temperature 42℃ in summer. A high thermal conductivity graphite aluminum radiator is designed, which breaks through the technical drawbacks of conventional liquid preparation and solid preparation of high thermal conductivity composite materials. Using natural flake graphite and micron grade ultra-thin aluminum foil as the substrate, the unique multi-layer sandwich structure is formed by hot pressing at high temperature. The thermal conductivity of the two base planes can reach 600~1000 W/mK, which can reduce the temperature of the power amplifier chip by more than 8℃ compared with conventional aluminum extrusion radiator, this solution can ensure RF oven works safely under high temperature conditions.

Key words: RF heating oven, Power Amplifier, Electronic heat dissipation, Graphic-aluminum, High conductivity