Journal of Appliance Science & Technology ›› 2022, Vol. 0 ›› Issue (2): 40-43.doi: 10.19784/j.cnki.issn1672-0172.2022.02.006
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YAO Xinxiang, XIONG Shuo, XU Xingdong
Online:
Published:
Abstract: Under high temperature conditions, due to the large current of the whole machine and the poor heat dissipation conditions of main board components, the temperature rise of components is relatively high. In order to ensure the reliability of the whole machine, the compressor is usually controlled to operate at a lower frequency to reduce the current of the whole machine and the temperature rise of the main board. This way leads to the decline of the performance of the air conditioner and affects the comfort of users. In order to solve this problem, the causes of component temperature rise are analyzed in detail, and a solution to reduce componenttemperature rise by strengthening heat exchange and optimizing component selection is proposed. The effectiveness of the solution is proved by theoretical analysis and experimental verification.
Key words: Motherboard, Temperature rise, Enhanced heat dissipation, Frequency converter, Rectifying bridge
CLC Number:
TM571
TM502
YAO Xinxiang, XIONG Shuo, XU Xingdong. Research and analysis on reducing the temperature rise of inverter main board under high temperature[J]. Journal of Appliance Science & Technology, 2022, 0(2): 40-43.
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URL: http://www.jdkjjournal.com/EN/10.19784/j.cnki.issn1672-0172.2022.02.006
http://www.jdkjjournal.com/EN/Y2022/V0/I2/40