Abstract: Aiming at the heat dissipation requirement of the the integration and lightweight electronic control components such as the intelligent power module (IPM), the heat sink of the IPM module is designed. After establishing the numerical model of the heat sink and the electronic control system, the influence factors such as IPM heat sink fin orientation, fin spacing, and fin surface treatment methods on the temperature rise of the intelligent power module are explored. The simulation results indicate that the heat dissipation efficiency of the fins which is parallel to the direction of gravity is 9% better than the vertical direction of gravity fins. The average temperature of the heat sink decreases first and then increases with the increase of the fin, the optimal fin spacing is exist. In addition, compared with the fin surface protrusion process, the blackening of the fin surface has a greater impact on the IPM temperature, the heat dissipation efficiency improved by 16.6%. Finally, the designed optimal fin structure is experimentally verified with better performance, and higher economic benefits.

Key words: Intelligent power module (IPM), Refrigerator, Heat sink, Surface treatment