家电科技 ›› 2026, Vol. 0 ›› Issue (1): 90-93.doi: 10.19784/j.cnki.issn1672-0172.2026.01.014

• 论文 • 上一篇    下一篇

具有微穿孔面板的迷宫型超材料在降低通风噪声中的应用研究

陈澎钰1,2, 王相乾1,2, 陈国平1,2, 栾强利1   

  1. 1.海信家电集团有限公司 山东青岛 266100;
    2.海信空调有限公司 山东青岛 266100
  • 出版日期:2026-02-01 发布日期:2026-05-07
  • 作者简介:陈澎钰,本科学历,高级工程师。研究方向:空调减振降噪。地址:山东省青岛市崂山区松岭路399号海信家电研发中心。E-mail:chenpengyu@hisense.com。

Research on the application of maze-type metamaterials with microperforated panels in reducing ventilation noise

Chen Pengyu1,2, Wang Xiangqian1,2, Chen Guoping1,2, Luan Qiangli1   

  1. 1. Hisense Home Appliance Group Co., Ltd. Qingdao 266100;
    2. Hisense Air Conditioning Co., Ltd. Qingdao 266100
  • Online:2026-02-01 Published:2026-05-07

摘要: 通过仿真和测试对比不同背腔深度下微穿孔板的吸声系数,验证了传递导纳矩阵对其声学特性定义的准确性。设计由微穿孔板和迷宫型结构组成的声学超材料吸声单元,经仿真和测试,明确了微穿孔板特性对吸声峰值、频率及带宽的调控作用。基于上述结论,设计了针对风管机通风噪声的降噪模组,经测试,同风量下各挡降噪量为 4 dB左右,最大单频降噪量达 16.7 dB,降噪效果显著,为空调通风噪声控制提供了技术参考。

关键词: 微穿孔板, 声学超材料, 通风噪声, 仿真

Abstract: By comparing the sound absorption coefficients of microperforated panels under different back cavity depths through simulation and test of microperforated panels under different back cavity depths, the accuracy of the transfer admittance matrix in defining their acoustic characteristics was verified. An acoustic metamaterial sound absorption unit composed of a microperforated panel and a Maze-Type structure was designed. Through simulations and experiments, the regulatory role of microperforated panel characteristics on the sound absorption peak, frequency, and bandwidth was clarified. Based on the above conclusions, a noise reduction module targeting the ventilation noise of ducted air conditioners was developed. Test results show that under the same air volume, the noise reduction amount at each fan speed level is approximately 4 dB, and the maximum single-frequency noise reduction amount reaches 16.7 dB. The noise reduction effect is significant, providing a technical reference for ventilation noise control.

Key words: Microperforated Panel, Acoustic Metamaterial, Ventilation Noise, Simulation

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