Abstract: With the rapid development of the electronics industry, the integration of electronic products is getting higher and higher, and ion pollution tests are increasingly appearing in the circuit board industry. However, for semi-finished boards after wave soldering, there is currently no complete control requirement for ion pollution in the industry. The researcher conducted experimental verification by optimizing the wave soldering process parameters and the placement time of semi-finished products, and used ion chromatography to test and evaluate. The experimental results showed that the material characteristics of wave soldering flux and the amount of flux sprayed on the printed circuit board surface The degree of contamination will have a great impact, and the spray process parameters are not a key factor. Provide direction for the subsequent reduction of the impact of ion cleanliness on printed circuit board assembly (PCBA).

Key words: Wave soldering, Ion cleanliness, Flux