Abstract: Aiming at the back cover of the mobile phone connected by the back glue, the automatic and nondestructive disassembly of the back cover of the mobile phone is realized. The device uses HX711 to detect whether the electric gripper clamps the mobile phone, DS18B20 to detect the temperature, and TB6560AHQ to control the forward and reverse of the motor. During the process, LCD1602 displays the working status of disassembly with timing function and alarm device reminder. At the same time, the process of heating and dismantling is simulated by finite element method. In order to ensure the accuracy of temperature control system, variable parameter PID algorithm is adopted. Finally, through the analysis of the experiment, the efficient and reliable disassembling effect is obtained.

Key words: Back glue connection, Dismantling equipment, PID, Simulation analysis