Journal of Appliance Science & Technology ›› 2018, Vol. 0 ›› Issue (1): 52-54.
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XU Shiming
Online:
Published:
Abstract: This paper presents a new methold for wire bonding process of semiconductor industry, to eliminate the resonant problem between lead frame and metal base in wire bonding process, and to improve the appearance consistency of the power devices wire bonding.
Key words: Power devices, Wire bonding, Shockproof base
XU Shiming. A methold to improve the appearance consistency of the power devices wire bonding[J]. Journal of Appliance Science & Technology, 2018, 0(1): 52-54.
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