Journal of Appliance Science & Technology ›› 2018, Vol. 0 ›› Issue (1): 52-54.

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A methold to improve the appearance consistency of the power devices wire bonding

XU Shiming   

  1. Zhuhai GREE Xinyuan Electronics Co. Ltd. Zhuhai 519110
  • Online:2018-01-01 Published:2019-07-12

Abstract: This paper presents a new methold for wire bonding process of semiconductor industry, to eliminate the resonant problem between lead frame and metal base in wire bonding process, and to improve the appearance consistency of the power devices wire bonding.

Key words: Power devices, Wire bonding, Shockproof base