Abstract: :In order to ensure the stable operation of the electronic components, the industry usually uses hot melt adhesive to fix components. Because of the hardness of the hot melt adhesive, and the constant release of stress in the curing process.there is a certain risk to the reliability of the product. In recent years, new adhesive fixation adhesive has been constantly pushed onto the market. This paper compares the properties of several fixed adhesive, assessing whether or not it can be used in air conditioned electronic products. Objective to find a new adhesive, which can meet the requirements of use and is green and environmental friendly.

Key words: Adhesive fixed adhesive, PCBA, Reliability