家电科技 ›› 2024, Vol. 0 ›› Issue (1): 66-71.doi: 10.19784/j.cnki.issn1672-0172.2024.01.010

• 论文 • 上一篇    下一篇

集成灶蒸烤箱温度场改善的仿真模拟及实验研究

王志江, 邹宇辉, 赵科, 殷彤彤   

  1. 浙江苏泊尔厨卫电器有限公司 浙江绍兴 312073
  • 出版日期:2024-02-01 发布日期:2024-03-13
  • 作者简介:王志江,工程硕士学位。研究方向:热力学与流体力学。地址:浙江省绍兴市柯桥区经济技术开发区兴滨路399号。E-mail:wzjiang@supor.com。

Simulation and experimental study on thermal field improvement of integration cooking appliances

WANG Zhijiang, ZOU Yuhui, ZHAO Ke, YIN Tongtong   

  1. Zhejiang Supor kitchen and bathroom appliance Co., Ltd. Shaoxing 312073
  • Online:2024-02-01 Published:2024-03-13

摘要: 集成灶由于结构尺寸的原因,其蒸烤模块内胆往往呈扁长形,导致其温度均匀性较差,这一点在以烤盘作为食物载体时表现得更加明显。分别以烤架和烤盘作为食物载体对蒸烤模块内部温度作了仿真模拟计算,发现烤盘作为食物载体时,蒸烤模块内部温度场较差。通过对风扇转速和烤盘结构优化发现,在循环风机转速由800 r/min提升到1500 r/min,同时在烤盘两侧把手处增加10个总面积为2606.27 mm2的通孔方案时,烤盘温度均匀性由23.3℃提升到5.3℃。研究结果为后续蒸烤类产品的技术研究和新品开发提供了理论价值和数据基础。

关键词: 集成灶, 蒸烤模块, 温度均匀性

Abstract: Due to the structural of the integration cooking appliances, steam oven modular’s tank is often flat and long, resulting in poor temperature uniformity, which is more obvious when the baking tray is used as the food carrier. The internal temperature of the steaming oven module is simulated by using the grill and the baking pan as the food carrier, and it is found that the internal temperature field of the steaming oven module is poor when the baking pan is used as the food carrier. Through the optimization of fan speed and baking pan structure, it is found that when the rotation speed of the circulating fan is increased from 800 r/min to 1500 r/min, and 10 through-hole schemes with a total area of 2606.27 mm2 are added to the handles on both sides of the baking pan, the temperature uniformity of the baking pan is increased from 23.3℃ to 5.3℃. The results of this study provide theoretical value and data basis for the subsequent technical research and new product development of steamed and baked products.

Key words: Integration cooking appliances, Steam oven modular, Temperature uniformity

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