家电科技 ›› 2022, Vol. 0 ›› Issue (zk): 87-91.doi: 10.19784/j.cnki.issn1672-0172.2022.99.018

• 第一部分 优秀论文 • 上一篇    下一篇

基于石墨铝的射频烤箱功率放大器高温工况散热研究

张传美1,2,3, 王定远1,3, 耿丽丽1,2,3, 段耀铎1,2, 姚廷明1,3, 裴玉哲1,3   

  1. 1.青岛海尔智能技术研发有限公司 山东青岛 266103;
    2.海尔(上海)家电研发中心有限公司 上海 201100;
    3.数字化家电国家重点实验室 山东青岛 266103
  • 发布日期:2023-03-28
  • 作者简介:张传美,硕士学位。研究方向:高温电子散热和新型制冷研究。地址:上海市闵行区申长路668号冠捷大厦。E-mail:zhangchuanmei@haier.com。

Research on new heat dissipation technology for RF heating oven’s amplifier modules based on graphite aluminum under high ambient temperature condition

ZHANG Chuanmei1,2,3, WANG Dingyuan1,3, GENG Lili1,2,3, DUAN Yaoduo1,2, YAO Tingming1,3, PEI Yuzhe1,3   

  1. 1. Qingdao Haier Smart Technology R&D Co., Ltd. Qingdao 266103;
    2. Haier (Shanghai) Home Appliances R&D Center Shanghai 201100;
    3. State Key Laboratory of Digital Home Appliances Qingdao 266103
  • Published:2023-03-28

摘要: 射频烤箱采用固态微波加热技术,相比传统微波加热技术速度快且温度均匀、食物加热状态可智能反馈,其核心电控板上功率放大器等芯片尺寸小但功耗大导致热流密度极高,当夏季环境温度高达42℃时,现有铝挤散热器方案无法有效散热。研究设计了一种高导热石墨铝的散热器,突破常规液态制备和固态制备高导热复合材料的技术弊端,利用天然鳞片石墨和微米级超薄铝箔为基材,高温热压成独特的多层三明治结构,两个基面方向导热系数可达600~1000 W/mK,相比常规铝挤散热器可将功率放大器芯片温度降低8℃以上,保障RF烤箱在高温工况安全工作。

关键词: 射频烤箱, 功率放大器, 电子散热, 石墨铝, 高导热

Abstract: Compared with traditional microwave heating technology, RF oven using solid-state microwave heating technology which is heating fast and uniform, the status of food heating can be intelligent feedback, the size of core component power amplifier on electronics control board is small but with large power consumption, cause extremely high heat density. The traditional extruded heat sink cannot be effective under harsh ambient temperature 42℃ in summer. A high thermal conductivity graphite aluminum radiator is designed, which breaks through the technical drawbacks of conventional liquid preparation and solid preparation of high thermal conductivity composite materials. Using natural flake graphite and micron grade ultra-thin aluminum foil as the substrate, the unique multi-layer sandwich structure is formed by hot pressing at high temperature. The thermal conductivity of the two base planes can reach 600~1000 W/mK, which can reduce the temperature of the power amplifier chip by more than 8℃ compared with conventional aluminum extrusion radiator, this solution can ensure RF oven works safely under high temperature conditions.

Key words: RF heating oven, Power Amplifier, Electronic heat dissipation, Graphic-aluminum, High conductivity

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