Abstract: after long-term grilling and cooking in the oven, the inner walls of the baking cavity often accumulate and settle a lot of grease and dirt, especially in the corners which are difficult to clean, becoming a pain point in the industry. Through the innovative design of high-temperature self-cleaning technology for the oven, the intelligent control program can rapidly heat the oven to an extremely high temperature of over 450℃ within 30 minutes, and then take about 90 minutes to incinerate or thematically crack the food residues, grease stains and other impurities inside. After cooling to room temperature, it only needs a simple wipe to shine like new and complete the cleaning. In view of the large amount of residual heat generated during the high-temperature cleaning process, an efficient thermal management system is needed to support temperature control under different modes, maintaining a dynamic balance between heat generation and heat dissipation, and avoiding excessive temperature rise under working conditions that could lead to the failure of control electronic components. This has become an urgent key technical problem to be solved. Through the analysis of the mechanism of the high-temperature self-cleaning function of the oven, a digital model of the temperature rise under the high-temperature self-cleaning condition of the oven was built. The key factors affecting the temperature rise and the technical parameters of the main components were carefully selected and optimized. Combined with CAE simulation analysis and experimental verification, the temperature rise in the space of the high-temperature self-cleaning box of the oven was reduced from 84.61 ℃ to 68.58 ℃. Ensure the safety and reliability of the electronic components of the control system and the entire machine, and effectively enhance the cleaning effect.

Key words: Oven, High-temperature self-cleaning, Intelligent control, Digitalization, Research and application