关键词: 多层片式瓷介电容（MLCC）, 基板弯曲, 可靠性

Abstract: This disquisition is related to the aftersales data of multi-layer ceramic capacitors for air-condition, by means of the metallographic observation of the internal structure of MLCC. The main failure reason is that the mechanical stress causes the end electrode to crack. After checking the incoming, production transportation and other links, the results show that the main failure reason of MLCC is the excessive bending of PCB board in the process of installation and transportation, which leads to the failure of the capacitor under excessive mechanical stress. Therefore, the bending strength of the MLCC limit substrate of different materials, packages and capacitance values is obtained, which provides a corresponding numerical reference for the hardware design and improves the reliability design of the product.

Key words: Multi-Layer Ceramic Capacitors(MLCC), Substrate bending, Reliability